Archive for August, 2010

New -70° to +150° C POL DC-DC Converter from Crane Aerospace & Electronics, Interpoint brand

Tuesday, August 31st, 2010

Crane Aerospace & Electronics, Interpoint brand is proud to introduce the MFP Series TM of POL converters. The first products in a new line of Point of Load converters, the MFP Series offers Maximum Flexibility through its rich feature set and is designed to produce stable power across a wide temperature range of -70° to +150° C. The MFP Series delivers exceptionally low noise performance, requiring no external capacitors.
Ed Fuhr, Vice President of Power Solutions for Crane Aerospace and Electronics, states “This new addition to the Interpoint product line provides a simple solution that is easy to integrate into today’s demanding low voltage high current designs. We are truly excited about the strength and flexibility the MFP Series Point of Load converters bring to the marketplace.”
The highly efficient MFP Series is the first of our new smaller, quieter, robust products coming to the market. Four preset output voltages of 0.8, 1.6, 2.5, and 3.3 can be configured with no trim resistors required. Trim resistors can be used to achieve voltages over the full range of 0.8 to 3.4 volts.
The MFP Series converters are rich with features, including input synchronization from 300 to 600 kHz to sync to the system or other MFPs, output current monitor, output remote sense, output short circuit protection, and input inrush current limiting. With an input voltage range of 3.0 to 6.0 volts, the converters can handle up to a 15 volt transient for a full second in addition to full input over-voltage protection. The converters support input voltages as low as three volts with no external supply. The MFP Series converters will be available to the general market in the full range of screening options. For more information, download the technical preview at www.interpoint.com/019.
Crane Electronics Group, Power Solutions, offers Interpoint brand DC/DC converters and EMI filters with proven performance in extreme environments where high reliability is required and failure is not an option. Crane Electronics Group is a major supplier of systems and components for critical aerospace, space, and defense applications. Product and service offerings are organized in solution sets and include Power Solutions, Microwave Systems Solutions, and Microelectronics Solutions. Products are manufactured under the brand names ELDEC, Interpoint, and Signal Technology. For more information on Crane Electronics, visit www.craneae.com and for Crane Co., visit www.craneco.com.
Crane Co. is a diversified manufacturer of highly engineered industrial products. Crane Co. is traded on the New York Stock Exchange (NYSE: CR).

This article was taken from: gotopower.net

Lightweight Brake Disc for Vehicle Manufacturers

Thursday, August 26th, 2010

SAF-Holland, a supplier of parts for commercial vehicles, has developed a lightweight disc brake for semi-trailers and trailers in co-operation with brake manufacturer Haldex.

The weight reduction per axle is 12kg or 36kg for a trailer with a tri-axle suspension.

The SAF SBS 2220 has been designed for brake torques of up to 20kNm and disc brake rotors with a diameter of 430mm.

This makes it suitable for both semitrailers and trailers with axle loads up to nine metric tonnes combined with 22.5in tyres.

Olaf Drewes, director – research and development axles and brakes at SAF-Holland, said the key benefit compared with conventional disc brakes is a significant reduction in weight without compromising performance.

There are two measures that have made this possible: all brake components were submitted to an intensive finite element analysis and were specifically optimised with regard to weight and strength.

In addition, a lightweight single-tappet mechanism with integrated T-shaped wide thrust plate has been developed for the application of the brake.

As a result, the brake pads are extensively supported and pressed evenly against the brake disc, leading to homogeneous pressure distribution.

Drewes said this ensures a good performance in terms of brake retardation under any operating conditions.

In addition, it reduces the risks of heat cracks and uneven wear.

For a quick and easy disc change, SAF-Holland has retained the SAF four-hole interface with positive alignment for the SBS 2220.

That way, the brake with its four fixing bolts can be dismantled easily and safely at any time.

Transport companies’ uptime is further ensured by encapsulating the stainless steel calliper guide pins, which are matched to specially-coated composite bearings and non-wear and non-lubricated plain bearings along with rugged inverted mechanism bellows.

This allows greater protection from external dirt and debris, for example.

If necessary, the brake pads can be exchanged quickly and simply.

The entire calliper housing has special protection against corrosion with cathodic dip coating.

The SAF disc brake SBS 2220 can be combined with any SAF nine-tonne axle units and can be used with conventional or Integral discs.

This applies to wheel offsets 0 and 120 as well as single and twin tyres.

Combining the low-weight brake with SAF Integral brake disc can be particularly economical, according to SAF-Holland.

Its composite cast design has proved to be powerful and durable.

In addition, it is claimed to be the only brake disc within the industry that offers a special guarantee against continuous heat cracks.

With only 31kg including brake pads, the SAF disc brake SBS 2220 will create a lot of interest with vehicle manufacturers and freight forwarders, Drewes said.

This article was taken from: engineeringtalk.com

Ericsson’s Ground Breaking Digital DC/DC Converter Goes Surface Mount To Save Board Space

Monday, August 23rd, 2010
  • Industry first high efficiency digitally controlled DC/DC converter compliant to full surface-mount manufacturing processes
  • Floating Inserted Pins guarantee high co-planarity and robustness
  • High efficiency and digital control reduce power consumption

Based on the company’s ground breaking BMR453 DC/DC converter, Ericsson Power Modules’ BMR453 SI version adds the company’s innovative Floating Inserted Pins (FIP) technology to offer a surface mount version that enables higher density boards to be designed and used.

Introduced in June 2008, Ericsson’s ‘industry first’, digitally controlled, PMBus compliant BMR453 DC/DC converter brought a new dimension to the way system designers considered power management and how to optimize the energy delivered to core processors or to a single sub-function at a very low board-level.

Because board density is increasing, and to simplify manufacturing processes, board designers are requiring power modules suppliers to offer surface mount alternatives to conventional through-hole versions. This is not generally a problem at low and mid-power levels, but it is a real challenge when considering high power modules and even more of a challenge when such modules require additional I/O. That is the challenge that Ericsson Power Modules addressed when developing its mechanical FIP concept.

Ericsson Power Modules’ FIP concept is based on highly accurately tooled pins that are inserted and aligned during the original assembly process. When a BMR453-SI module is assembled on the final board, during reflow the pins remain aligned in the plated through-hole of the converter, and self-adjust to guarantee perfect interconnection between the two solder pads. The pins are also manufactured with very tight tolerances, guaranteeing co-planarity and mechanical accuracy. This process ensures high reliability and host equipment availability.

In addition to input and output power connections, additional I/O (+ and – output remote sense, address pin, PMBus clock and data, power good and user configurable I/O, PMBus ground, PMBus alert signal and PMBus remote control or current sharing) are made available through a micro-interface. This connector has been designed to comply with Ericsson FIP technology and to guarantee full alignment and co-planarity during the different soldering processes.

Since its introduction, the BMR453 has received a high level of market interest and when considering ways to reduce energy consumption and attain better energy control at board level, many systems architects now consider the BMR453 to be a key contributor to their energy-saving projects, resulting in a large numbers of applications that are now entering into volume production.

“A customers’ design cycle when using a new board mounted power module in the ICT industry – especially when introducing such high level of features – is about two years, and our customers are now moving to volume manufacturing and requiring access to conventional and surface mountable version of our BMR453” said Patrick Le Fèvre, Marketing and Communication Director of Ericsson Power Modules. “The addition of a surface mountable version to Ericsson’s ‘world-first’ digitally controlled and PMBus compliant BMR453 DC/DC converter reflects the huge market interest for such products and also the technology that will contribute to reduce energy consumption.”

Based on a digital control loop and including a PMBus interface, the BMR453 SI is the first surface mount isolated DC/DC converter to make it possible for system architects to precisely monitor, control and adjust parameters in real time. Through a board power manager or a PMBus interface embedded into the board controller, system architects can precisely adjust the intermediate bus voltage to suit load conditions but also to read back data from the BMR453 giving information about load, temperature, voltage and other parameters indicating boards’ status, making it possible to pro-actively decide what action to take. As well, the built-in digital control loop self-optimizes switching dead time, guaranteeing that DC/DC power consumption remains the lowest whatever the load condition is, resulting in high efficiency from low load to full load condition.

With 96% efficiency, the BMR453 SI offers up to 396W output power or up to 33A with ±2% accuracy. Showing versatility, the BMR453 has an input voltage range of 36V to 75V, and its output voltage is variable from 8.1V to 13.2V. With a maximum height of 11.5mm, the BMR453 SI is compatible with reduced board-space applications or cold-wall equipments requiring low height.

BMR453 SI’s micro controller sweeps up a large quantity of discrete control and overhead components resulting in better integration, lower component count, less PCB area, and improved reliability. The net result for the customer is gains in virtually all areas; increased power density, greater accuracy, a much higher level of control and integration within a system, and reduced through life cost of ownership as a result of its high efficiency and intelligent use of energy management.

Prime customers using such products are from the Information and Telecommunication Technology such as datacenters, routers, telecom equipment and a large range of applications where system designers are considering ways to reduce energy consumption by using an optimized energy solution.

This article was originally printed on the European Power Supply Manufacturers Association website here: http://www.epsma.org/members_PR.htm#67

IEEE Approves 40/100-Gbit/s Ethernet Standard

Thursday, August 19th, 2010

After about four years of work, the IEEE 802.3ba Task Force has ratified the 802.3ba Ethernet standard. It covers communications with Ethernet at 40 and 100 Gbits/s across backplanes, copper cabling, multi-mode fiber (MMF), and single-mode fiber (SMF), moving our networking speeds forward by another order of magnitude.

Each Ethernet standard has incremented the data speed by another decade, in this case to an amazing 100 Gbits/s. But unique to 802.3ba is a 40-Gbit/s option that fits many existing applications. It’s a welcome addition to Ethernet, as it continues to scale with the need. Originally a local-area networking (LAN) technology, Ethernet has gone far beyond its roots thanks to a continuous standards effort. The new standard paves the way for the next generation of high-rate server connectivity and core switching.

The 802.3ba standard was designed to maintain the well-known and widely supported Ethernet frame format and the media access controller (MAC), as well as to create new physical layers (PHYs) for 40 and 100 Gbits/s. It also will support full-duplex only and a 10–12 bit error rate (BER) at the PHY/MAC interface. And, it will work with the ITU’s Optical Transport Network (OTN) for long haul networks.

For 40 Gbits/s, the PHYs include 10 km on SMF, 100 m on optical multimode 3 (OM3) MMF, 10 m on copper cable, and 1 m on a backplane. For 100 Gbits/s, the PHY goals include 40 km on SMF, 10 km on SMF, 100 m on OM3 MMF, and 10 m on a copper cable. For the most part, the task force met these objectives except for 10 m over copper cable, specifying a maximum range of 7 m instead. Also, a range of 150 m was achieved at 100 Gbits/s over optical multimode 4 (OM4) MMF. No tricky new modulation schemes are used, and the data format is plain-old NRZ using optical technology.

Other features include the use of 64B/66B encoding for error correction and a mix of PHY options. For example, the 40-Gbit/s and 100-Gbit/s versions for a 100-m reach are based on multiple fibers carrying 850-nm laser data. It also includes four OM3 MMFs for 40 Gbits/s and 10 OM3 MMFs for 100 Gbits/s. For the longer 10-km reach options, the medium is SMF.

Multiple wavelengths of 1270, 1290, 1310, and 1330 nm are used for 40 Gbits/s. With 64B/66B coding, the signaling rate is 10.3125 Gbits/s. For 100 Gbits/s, data is transmitted at 28.78125 Gbits/s over 1295, 1300, 1305, and 1310 nm. All these wavelength-division multiplexed (WDM) formats match up with what the International Telecommunication Union (ITU) specifies for its long-haul optical transport network (OTN) fiber networks.

The 802.3ba standard addresses critical challenges facing technology providers today, such as the growing number of applications with demonstrated bandwidth needs far exceeding existing Ethernet capabilities, by providing a larger, more durable bandwidth pipeline. Furthermore, collaboration between the IEEE P802.3ba 40-Gbit/s and 100-Gbit/s Ethernet Task Force and the ITU’s Telecommunication Standardization Sector (ITU-T) Study Group 15 ensures these new Ethernet rates are transportable over OTNs.

“Ubiquitous adoption of bandwidth-intensive technologies and applications, such as converged network services, video-on-demand, and social networking, is producing rapidly increasing demand for higher-rate throughput,” says John D’Ambrosia, chair of the IEEE 802.3ba Task Force and director of Ethernet-based standards, as well as CTO of Force 10 networks.

“As mass-market access to these technologies continues accelerating, coupled with today’s progressively more powerful server architectures, data centers, network providers, and end users alike are finding themselves confronted by pressing bandwidth bottlenecks,” D’Ambrosia adds. “IEEE 802.3ba will eliminate these bottlenecks by providing a robust, scalable architecture for meeting current bandwidth requirements and laying a solid foundation for future Ethernet speed increases.”

The new standard will act as the catalyst needed for unlocking innovation across the greater Ethernet ecosystem. IEEE 802.3ba is expected to trigger further expansion of the 40-Gbit and 100-Gbit Ethernet family of technologies by driving new development efforts. It also will provide new aggregation speeds that will drive new 10-Gbit/s Ethernet network deployments.

Furthermore, the standard’s ratification dovetails with efforts aimed at delivering greater broadband access, such as the U.S. Federal Communication Commission’s “Connecting America” National Broadband Plan, which calls for 100-Mbit/s access for a minimum of 100 million homes across the U.S.

In addition to providing an increased bandwidth pipeline, IEEE 802.3ba remains compatible with existing IEEE 802.3 installations, preserving significant industry investment in the technology. The standard is also expected to generate concrete benefits, such as lowered operating expense costs and improved energy efficiencies, by simplifying complex link aggregation schema commonly used in today’s network architectures.

Key players waiting to adopt 802.3ba include users and producers of systems and components for servers, network storage, networking systems, high-performance computing, data centers, telecommunications carriers, and multiple system operators (MSOs).

The PDF version of the approved standard is available for purchase at shop.ieee.org. The Ethernet Alliance also has a good white paper on 40/100-Gbit/s Ethernet at http://www.ethernetalliance.org/.

This article was taken from: Eletronic Design

Compact 650W AC/DC Power Supply for Medical or Industrial Applications

Monday, August 16th, 2010

XP Power today announced the introduction of the SHP650 and MHP650 series of single output high power density fan cooled AC/DC power supplies. The MHP650 range meets the IEC60601-1 safety specification for medical equipment while the SHP650 range compiles with the IEC60950 standard for IT and industrial equipment. Both series are highly efficient, typically 86%, and have a high power density of 8.2 Watts/cubic inch.

Three mechanical mounting formats are available to provide design-in flexibility. Two fan-cooled formats provide the option of having the fan mounted internally on the top or externally mounted on the end of the unit. The integral fan speed is load dependent to aid minimizing noise. By using the U channel format designers can supply their own airflow; only 5.5 meters/second forced airflow is required. A +12 VDC, 6 W fan supply is provided when using this format.

All units operate from a universal 85-264 VAC input range with full power available from 90VAC. The operating temperature range is -20 C to +70 C with no derating below 50 C. Each series offers six output voltage variants covering the nominal voltages of +12, +15, +24, +28, + 36 or +48 VDC, and can be trimmed within +/- 10% of nominal. A +5VDC, 1W always on output is also provided for standby purposes.

Available control signals include AC OK and remote on/off. An active current share capability is also provided to allow sharing of load across multiple units or for configuration of redundant systems, remote sense is also provided.
Both the SHP and MHP are of rugged construction with screw terminals and a 3 year warranty.

This article was taken from: gotopower.net

New HEMP150G Series Green Power Adaptor

Thursday, August 12th, 2010

Green Power for Medical and ITE

“Save money and protect our environment for future generations!”

HiTRON ,Taiwan power supply manufacturer, has successfully developed its new HEMP150G series, a high efficiency 120-150Watt AC-DC Green Power adaptor.

HEMP150G series feature both ITE (Information Technology Equipment IEC60950-1) and Medical (IEC60601-1), bear the CE mark, conform to FCC/EN55022 Level B Conducted Emission Standard and meet the requirements for lower power consumption requirement stipulated in ENERGY STAR Level V and CEC(California Energy Commission)
Level IV.

HEMP150G have 90-264 VAC universal input range using the standard IEC320-C14, IEC320-C6 and IEC320-C8 AC receptacle and 12-24V output voltage range with PFC function which can comply with the harmonic requirement per EN61000-3-2 and also fulfill the requirements of various electronic equipments. HEMP150G series have 88-90% of high efficiency and power density of 3.53-4.38 per cubic inch. Output protection features include overvoltage,
overload and short circuit.

~ 90-264VAC Universal AC input
~ Built-in active PFC function
~ Meet both of Medical IEC60601-1 and ITE IEC60950-1
~ Desktop IEC320-C14/C8/C6 AC receptacle
~ No load power consumption<0.5W
~ Pass ENERGY STAR Level V and CEC Level IV
~ High efficiency 88-90%
~ Built-in Overload, Over voltage and Over temperature protection
~ cULus, CB and CE approval
~ Dimension: 180×72x43.55mm

We will be adding this product to the site very soon – please give us a call or send an email if you are interested in the meantime.

Precision D/A Converter Expectations

Monday, August 9th, 2010

How a 1ppm d/a converter can ease precision instrumentation design problems. By Maurice Egan. Original article here on NewElectronics.co.uk.

The push to improve the precision of instrumentation systems has led to performance improvements in d/a converters beyond 16bits, a benchmark previously achieved with cumbersome, expensive and slow Kelvin-Varley dividers.

Over time, however, the definition of what constitutes a precision d/a converter has changed as markets and technologies have evolved. Advances in semiconductor processing, d/a converter design and calibration techniques are enabling highly linear d/a converters which are stable and fast settling, while delivering a 20bit performance which is better than 1ppm. These small ics have guaranteed specifications, do not require calibration and are easy to use.

Applications for a 1ppm d/a converter vary from gradient coil control in medical MRI systems to precision source and positioning in mass spectrometry and test and measurement applications.

Performance measures
The circuit in Fig 1 delivers 1ppm performance; its key specifications are integral nonlinearity, differential nonlinearity and a peak to peak noise of 0.1Hz to 10Hz.

In Fig 1, U1 is a 20bit d/a converter with 1ppm linearity specifications. U2, a precision dual amplifier, is a force-sense buffer for the d/a converter reference inputs. U3, a precision output buffer, is required for load driving; its key requirements are similar to that of the reference buffers, including: low noise; low offset voltage; low drift; and low input bias current.

Even though precision sub ppm components are available, building a 1ppm system is not a task that should be taken lightly. The major contributors to errors in 1ppm accurate circuits are noise, temperature drift and thermoelectric voltages.

* Noise
To enable a true 1ppm system, noise contributions needs to be minimised. The noise spectral density of U1 is 7.5 nV/vHz. U2 and U3 specify noise density of 2.8 nV/vHz, much lower than the d/a converter’s contribution.
Wideband noise can be filtered, but low frequency noise in the 0.1Hz to 10Hz range (1/f) cannot and the most effective method of minimising this is in component optimisation and selection. U1 generates 0.6µV p-p of noise in the 0.1Hz to 10Hz bandwidth, much less than the 1LSB level (19µV for a ±10V output). The design target for 1/f noise in the system should be approximately 0.1 LSB or around 2µV. The three amplifiers in the signal chain generate a total of approximately 0.2µV p-p of noise at the circuit output. Add this to the 0.6µV p-p of U1 and the total expected 1/f noise is 0.8µVp-p.

* Temperature drift
Temperature drift is another major source of error in precision circuits. U1 exhibits a temperature coefficient of 0.05ppm/°C. U2 drifts at 0.6µV/°C, which introduces an overall 0.03 ppm/°C drift into the circuit. U3, meanwhile, contributes a further 0.03 ppm/°C of output drift. These contributions add up to 0.11 ppm/°C. For scaling and gain circuits, low drift, thermally matched resistor networks are recommended, such as Vishay series 300144Z and 300145Z.

* Thermoelectric voltages
Thermoelectric voltages are the result of the Seebeck effect, where temperature dependent voltages are generated at dissimilar metal junctions. The generated voltage can be anywhere between 0.2µV/°C for a copper to copper junction and 1mV/°C for a copper to copper oxide junction.
Thermoelectric voltages manifest as a low frequency drift similar to 1/f noise and can be greatly reduced by keeping all connections clean and oxide free as well as shielding circuitry from air currents. Fig 4 shows the difference in voltage drift between a circuit that is open to air currents and a circuit that is shielded.

Long term stability
Precision analogue ics are stable devices, but do undergo long term age related changes. The d/a converter’s long term stability is typically better than 0.1ppm/1000hr at 125°C, but the aging is not cumulative; rather, it follows a square root rule. If a device ages at 1ppm/1000hr, it will age at v2ppm/2000hr, v3ppm/3000hr and so on. This is typically 10 times longer for each 25°C reduction in temperature, so, when operating at 100°C, one can expect ageing of 0.1ppm over 10000hrs – approximately 60 weeks. If this is extrapolated, the device can be expected to age by 0.32ppm over a period of 10 years.

Circuit construction and layout
In a circuit where such a high level of accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. Design the pcb such that the analogue and digital sections are separated and confined to separate areas of the board.
There should be ample power supply bypassing of 10µF in parallel with 0.1µF on each supply located as close to the package as possible. The capacitors should have low effective series resistance and low effective series inductance. A series ferrite bead on each power supply line will further help to reduce high frequency noise getting through to the device.

The power supply lines should use as large a trace as possible to provide low impedance paths and to reduce the effects of glitches on the power supply line. Shield fast switching signals, such as clocks, with digital grounds to avoid radiating noise to other parts of the board; they should never be run near the reference inputs or under the package. Avoid crossover of digital and analogue signals and run traces on opposite sides of the board at right angles to each other to reduce the effects of feedthrough on the board.

Building a 1ppm a/d solution
A typical contemporary 1ppm a/d solution consists of two 16bit d/a converters – one major, the other minor. Their outputs are scaled and combined to yield increased resolution. The output from the major d/a converter is summed, with the output from the minor device attenuated so that it fills the resolution gaps between the major d/a converter’s LSB steps.

The combined outputs need to be monotonic, but not extremely linear, because high performance is achieved with constant voltage feedback via a precision a/d converter, which corrects for the inherent component errors. Thus, circuit accuracy is limited by the a/d converter, rather than the d/a converters. However, because of the requirement for constant voltage feedback and the inevitable loop delay, the solution is slow, potentially requiring seconds to settle.

Although this circuit can achieve 1ppm accuracy, it is complex, likely to require multiple design iterations and requires a software engine and precision a/d converter to achieve accuracy. To guarantee 1ppm accuracy, the a/d converter will also require correction – since an a/d converter with guaranteed 1ppm linearity is not available. The block diagram shown here illustrates the concept, but the actual circuit is far more complex, with multiple gain, attenuation and summing stages and many components.

Digital circuitry is also needed to facilitate the interface between both d/a converters and the a/d converter; not to mention the software required for error correction.

Author profile:
Maurice Egan is a product applications engineer for precision converter products with Analog Devices.

Paralleling Power Supply Outputs For Redundancy

Thursday, August 5th, 2010

Configuring a redundant power system is not just a matter connecting two power supplies in parallel: Alex Karapetian explains why. Original article here on electronicstalk.com.

The highest reliability attainable in a single power supply is not nearly as good as that of a redundant power system, in which the outputs of two (or more) power supplies are connected so that – even if one were to fail – the other(s) would continue to provide uninterrupted power to the load.

But implementing redundancy is not as straightforward as it may appear to be.

To have a redundant power system that will function as intended requires careful consideration not only of the power supplies to be used and the electrical configuration, but also of the physical arrangement.
As every power supply will fail at some point, it’s necessary to allow for quickly and easily replacing a supply that’s failed or is in need of refurbishment.

For example, if the supplies are within an assembly mounted in an equipment rack, equip the assembly with slides so that it can be extended out of the rack for access – and don’t forget to include handles on the front panel to pull it out.
Alternatively, some power supply manufacturers make supplies that can be plugged into the front panel of an enclosure or rack adapter, permitting a supply to be, quite literally, changed in a matter of seconds.
Another approach is to have the system’s controls and indicators located on a main control panel, but to mount the power supplies in a more accessible location a few feet away.

And the supplies should be mounted in such a way that they can be easily and quickly removed and replaced – for example, by using thumbscrews.
Similarly, it must be possible to do the actual connecting and disconnecting of the power supplies quickly and easily.
If the supplies have screw terminals or lugs rather than connectors, then use insulated connectors that can be easily pulled apart in the wiring cable to each supply.

An isolation diode must be used in series with the output of each power supply, for two reasons – to avoid the possibility of the combined output being shorted if the output of one supply should short, and to prevent current from one supply flowing back into the other and reverse biasing it (which could cause it to malfunction and possibly damage it).

Obviously, the use of diodes introduces a voltage drop in the output voltage from the supply as seen by the load.
This is especially significant at low voltages; for example, a 5V output might drop to only 4V.
Using Schottky diodes can minimise the drop, but doesn’t eliminate the need to allow for it.

Keep in mind that the supply must be capable of providing a voltage equal to the sum of the voltage required across the load, the diode drop and the drops (round trip.) in the wiring. Particularly at low voltages, the lower drop of a larger gauge wire can be a big help.

A typical power supply can compensate up to a volt or so of drops in the wiring, but may not be capable of compensating both the wiring and the diode drops of a redundant system.
And if you’re using remote sensing to regulate the voltage across the load, you might not be able to solve this problem by simply stepping up to a supply with a higher nominal output voltage (for example, going from a 5V supply to a 6V supply), because then the sense lines of that supply would try to maintain 6V across the load rather than 5V.

Therefore, be sure to use a supply that is capable of putting out a voltage high enough to compensate both the diode and wiring drops under worst-case conditions (usually, at low line voltage and with maximum rated load current being drawn), and also has the desired load voltage within its adjustment range.

A supply’s maximum output voltage is usually considered to be the high end of its adjustment range; for example, a supply with an output specified as 24+/-1V could be relied on to provide a maximum of 25V, so if the load requires 24V and if the combined drops will be no more than 1V, you’re in good shape.

Sometimes an easy solution to this potential problem is to use a wide range power supply; in the above example, a 0-30V supply adjusted to 24V would be capable of compensating “round-trip” drops up to 6V.
If two sources of AC power are available, providing separate AC wiring for each power supply permits using a different source of input power for each supply, resulting in the additional advantage of input power redundancy.

Even using two different branches of the same building power source will offer improved input redundancy.
A battery-backup UPS may also be used in series with one of the inputs, further improving overall reliability by permitting continued normal operation of the load even if both of the AC sources should fail simultaneously.

Although meters and/or indicator lights are helpful for monitoring, they don’t command attention and may not be checked regularly.
However, an audible alarm can’t be easily ignored.

Include an undervoltage alarm circuit on the output of each supply to detect if its output is lower than normal (or a relay can be used if you simply wish to know if an output is there or not), and use it to control an audible alarm, either built into the assembly containing the power supplies or remotely located where it will be heard.

The contact wiring for two or more relays can be cascaded so that only one audible alarm is required.
Checking the meters or indicator lights will then disclose which of the power supplies is low.

Power supply outputs don’t always go low when they fail; with linearly regulated supplies, the series pass transistors can short and the voltage can instead go high – by 50% or more in some cases – and quickly fry the load.

Therefore, it’s vitally important that power supplies used in redundant applications be equipped with overvoltage protection to assure that the output voltage can’t go much higher than the nominal under any circumstances Don’t use output fuses.
Virtually all power supplies today have output current limiting circuits that will drop the output faster than the time required for a fuse to blow, so including a fuse won’t accomplish anything.

And with most supplies the current limiting automatically resets after a surge, while a blown fuse is counterproductive to the intent of a redundant power system – always having the output present.

Space the power supplies away from sources of heat.
If convection air flow is restricted, use a fan.

Overheating dries out capacitors, which is probably the single greatest cause of power supply failure.
And speaking of capacitor dryout, schedule testing of both supplies at least annually to be certain that each is capable of functioning properly.

If the capacitors are drying out (reducing the output current capability of the supplies) and the supplies are sharing the load, it’s possible that working together they can support the load, but if one should fail the other won’t be able to support it by itself.
Or, if one supply is set slightly higher than the other, the first will provide all of the current because the isolation diode of the other won’t be forward biased; the voltmeter of the other may show that it’s maintaining its output voltage, but that doesn’t necessarily mean that it can support the entire load.

Slightly increase the output voltage of each power supply occasionally so that it will assume the entire load and verify that it can support the load by itself.

In summary, configuring a redundant power system isn’t as simple as connecting two power supplies in parallel.
It requires careful consideration not only of how the power supply outputs may be affected by the manner in which they are connected, but also of factors that may affect both short and long term performance, and a physical arrangement that permits safe and fast maintenance while the system remains on line.

The time spent will be well invested, greatly reducing the possibility of a failure in critical equipment at an inopportune time.